WESTERN DIGITAL INTRODUCES WORLDS FIRST 512 GIGABIT 64-LAYER 3D NAND CHIP

Information Technology Press Releases Tuesday February 14, 2017 13:13
Bangkok--14 Feb--Total Quality PR
Company to Present Paper on the Development of the New Chip at ISSCC

Western Digital Corp. (NASDAQ: WDC) announced that it has commenced pilot production of the company's 512 Gigabit (Gb) three-bits-per-cell (X3) 64-layer 3D NAND (BICS3) chip in Yokkaichi, Japan, with mass production expected in the second half of 2017. The first of its kind, the chip is the latest achievement in a nearly three-decades-long legacy of flash memory industry firsts from the storage leader.

"The launch of the industry's first 512Gb 64-layer 3D NAND chip is another important stride forward in the advancement of our 3D NAND technology, doubling the density from when we introduced the world's first 64-layer architecture in July 2016," said Dr. Siva Sivaram, executive vice president, memory technology, Western Digital. "This is a great addition to our rapidly broadening 3D NAND technology portfolio. It positions us well to continue addressing the increasing demand for storage due to rapid data growth across a wide range of customer retail, mobile and data center applications."

The 512Gb 64-layer chip was developed jointly with the company's technology and manufacturing partner Toshiba. Western Digital first introduced initial capacities of the world's first 64-layer 3D NAND technology in July 2016 and the world's first 48-layer 3D NAND technology in 2015; product shipments with both technologies continue to retail and OEM customers.

Western Digital presented a technical paper on the advancement in high aspect ratio semiconductor processing that made this technology achievement possible at the International Solid State Circuits Conference (ISSCC). Further details can be found by visiting http://isscc.org/.


Latest Press Release

Next-generation Blockchain Platform Locus Chain Debuts Coin Listing on Global Cryptocurrency Exchange Bibox

Locus Chain tokens, issued by the next-generation blockchain platform Locus Chain Foundation (Locus Chain), was listed today on Bibox, the global cryptocurrency exchange ranked in the top 10 of the world's exchange markets. According to Bibox's official...

VST ECS (Thailand) in collaboration with HPE Financial Services offer the leasing model to enable business agility to compete tomorrow

VST ECS Group, a leading ICT distributor in Asia Pacific by Mr. Somsak Pejthaveeporndej, Chief Executive Officer has announced a partnership with HPE Financial Services by Mr. Greg Chong, Regional Partner Manager and Mr. Opas Chalermkanjana, Financial...

Ping An Unveils AI Technology at International Maritime Silk Road Forum

The second 21st Century Maritime Silk Road Forum on International Communication was held in Zhuhai in 19-21 September. Jean-Pierre Raffarin, former Prime Minister of France and Thomas J. Sargent, the 2011 Nobel Prize winner for Economics delivered...

WeDo Technologies Closes Deal With Leading North American Service Provider to Deliver Revenue Assurance and Fraud Management Suite on Amazon Web Services

WeDo Technologies, an industry leader in revenue assurance and fraud management, is pleased to announce that a Tier-1 North American telecommunications service provider has selected WeDo Technologies' integrated revenue assurance (RA) and fraud...

RTB DELIGHTED TO CELEBRATE TRUE WIRELESS SALES ACHIEVING 10,000 UNITS LAUNCHING PAYBACK CAMPAIGN FOR CUSTOMERS OFFERING 10% DISCOUNT FOR 10 DAYS

RTB expresses pleasure to celebrate the success of True Wireless headphones achieving sales of 10,000 units, underlining the strong lead in advanced headphones innovation catering to a variety of new generation users' lifestyle, launching the special...

Related Topics