The X670E AORUS XTREME leads the way with an 18+2+2 direct digital power, which effectively improves system stability for unlocking the full potential of the new Ryzen(TM) 7000 series processors. To enhance the overall heat dissipation under overclocking and full-speed operation, GIGABYTE X670E and X670 motherboards are stacked with advanced thermal designs, such as the 8mm Mega-Heatpipe, the full-coveraged VRM heatsinks, and the M.2 Thermal Guard III heatsinks on the storage devices, so that the next-gen gaming performance and transmission speed can be fully unleashed on the new platform. The newly incorporated EZ-Latch Plus design on the X670E and EZ-Latch on the X670 motherboards streamline the PC building process by simplifying the graphics card removal with only an effortless push of a bottom and making M.2 SSD installation easier than ever without the use of a single screw.
GIGABYTE will launch four motherboards, including the flagship X670E AORUS XTREME, the enthusiast-grade X670E AORUS MASTER, the mainstream X670 AORUS ELITE AX, and the value-focused X670 GAMING X AX. These boards will go on sale on September 27, 2022. For more information on GIGABYTE X670E and X670 motherboards, please visit: https://bit.ly/AM5_X670
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Photo Caption - GIGABYTE Launches Four AMD X670 Motherboards for New Ryzen 7000 Processors